Home / Products / Capacitors / Ceramic Capacitors / C0402CH1C6R8D020BC
Manufacturer Part Number | C0402CH1C6R8D020BC |
---|---|
Future Part Number | FT-C0402CH1C6R8D020BC |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | C |
C0402CH1C6R8D020BC Status (Lifecycle) | In Stock |
Part Status | Obsolete |
Capacitance | 6.8pF |
Tolerance | ±0.5pF |
Voltage - Rated | 16V |
Temperature Coefficient | CH |
Operating Temperature | -25°C ~ 85°C |
Features | Low ESL |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 01005 (0402 Metric) |
Size / Dimension | 0.016" L x 0.008" W (0.40mm x 0.20mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.009" (0.22mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
C0402CH1C6R8D020BC Weight | Contact Us |
Replacement Part Number | C0402CH1C6R8D020BC-FT |
C0402C0G1C2R2B
TDK Corporation
C0402C0G1C2R2C020BC
TDK Corporation
C0402C0G1C2R4B
TDK Corporation
C0402C0G1C2R4C
TDK Corporation
C0402C0G1C2R7B
TDK Corporation
C0402C0G1C2R7C
TDK Corporation
C0402C0G1C300G
TDK Corporation
C0402C0G1C300J
TDK Corporation
C0402C0G1C330G
TDK Corporation
C0402C0G1C360G
TDK Corporation
XCV100E-8FG256C
Xilinx Inc.
M2GL050T-1FGG484
Microsemi Corporation
A3P250L-1VQ100
Microsemi Corporation
EP3C80F484C8
Intel
5CEBA4F17C6N
Intel
5SGXEA5N3F45C2N
Intel
XC2V1500-5FFG896I
Xilinx Inc.
A54SX32A-2BG329I
Microsemi Corporation
A3PE1500-1FGG676I
Microsemi Corporation
EPF10K100EQC240-1
Intel