Home / Products / Capacitors / Ceramic Capacitors / C2012X6S1A685M085AC
Manufacturer Part Number | C2012X6S1A685M085AC |
---|---|
Future Part Number | FT-C2012X6S1A685M085AC |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | C |
C2012X6S1A685M085AC Status (Lifecycle) | In Stock |
Part Status | Not For New Designs |
Capacitance | 6.8µF |
Tolerance | ±20% |
Voltage - Rated | 10V |
Temperature Coefficient | X6S |
Operating Temperature | -55°C ~ 105°C |
Features | Low ESL |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 0805 (2012 Metric) |
Size / Dimension | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.039" (1.00mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
C2012X6S1A685M085AC Weight | Contact Us |
Replacement Part Number | C2012X6S1A685M085AC-FT |
C2012CH2E102J085AA
TDK Corporation
C2012CH2E102K085AA
TDK Corporation
C2012CH2E122J085AA
TDK Corporation
C2012CH2E122K085AA
TDK Corporation
C2012CH2E152J085AA
TDK Corporation
C2012CH2E182K125AA
TDK Corporation
C2012CH2E332J085AA
TDK Corporation
C2012CH2E682K125AA
TDK Corporation
C2012CH2E821K060AA
TDK Corporation
C2012CH2E822K125AA
TDK Corporation
XC6SLX16-L1FT256I
Xilinx Inc.
M2GL010-FG484
Microsemi Corporation
AX500-1FG484M
Microsemi Corporation
EP3C80F484C8N
Intel
EP4CE55F23C7
Intel
A42MX09-PQ160A
Microsemi Corporation
M1A3P400-1FGG144I
Microsemi Corporation
LFE3-70EA-7LFN1156I
Lattice Semiconductor Corporation
10AX115H2F34E2SG
Intel
EP2C70F896C8N
Intel