Home / Products / Capacitors / Ceramic Capacitors / C3216X7R1E225M160AA
Manufacturer Part Number | C3216X7R1E225M160AA |
---|---|
Future Part Number | FT-C3216X7R1E225M160AA |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | C |
C3216X7R1E225M160AA Status (Lifecycle) | In Stock |
Part Status | Not For New Designs |
Capacitance | 2.2µF |
Tolerance | ±20% |
Voltage - Rated | 25V |
Temperature Coefficient | X7R |
Operating Temperature | -55°C ~ 125°C |
Features | Low ESL |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 1206 (3216 Metric) |
Size / Dimension | 0.126" L x 0.063" W (3.20mm x 1.60mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.071" (1.80mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
C3216X7R1E225M160AA Weight | Contact Us |
Replacement Part Number | C3216X7R1E225M160AA-FT |
CGA6M3X7R2E104M200AE
TDK Corporation
CGA6M3X7R2E154K200AA
TDK Corporation
CGA6M3X7R2E154M200AA
TDK Corporation
CGA6M3X7R2E224K200AA
TDK Corporation
CGA6M3X7S2A475M200AB
TDK Corporation
CGA6M3X7T2E334K200AA
TDK Corporation
CGA6M3X7T2E334M200AA
TDK Corporation
CGA6M3X8R1C685K200AB
TDK Corporation
CGA6M3X8R2A474K200AB
TDK Corporation
CGA6M3X8R2A474M200AB
TDK Corporation
XC4005E-3TQ144C
Xilinx Inc.
XC4013XL-3PQ208C
Xilinx Inc.
A3P250-2VQG100
Microsemi Corporation
EP2S30F484C3
Intel
EP3SE50F484C2
Intel
EP3C25F256C6N
Intel
5SGXMA7N1F45I2N
Intel
A3P250L-FGG144
Microsemi Corporation
LCMXO640C-3M132C
Lattice Semiconductor Corporation
EP4SGX180FF35I4N
Intel