Home / Products / Capacitors / Ceramic Capacitors / CGA2B2X8R1H151M050BD
Manufacturer Part Number | CGA2B2X8R1H151M050BD |
---|---|
Future Part Number | FT-CGA2B2X8R1H151M050BD |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | CGA |
CGA2B2X8R1H151M050BD Status (Lifecycle) | In Stock |
Part Status | Not For New Designs |
Capacitance | 150pF |
Tolerance | ±20% |
Voltage - Rated | 50V |
Temperature Coefficient | X8R |
Operating Temperature | -55°C ~ 150°C |
Features | Epoxy Mountable |
Ratings | AEC-Q200 |
Applications | Automotive |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 0402 (1005 Metric) |
Size / Dimension | 0.039" L x 0.020" W (1.00mm x 0.50mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.020" (0.50mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
CGA2B2X8R1H151M050BD Weight | Contact Us |
Replacement Part Number | CGA2B2X8R1H151M050BD-FT |
CGA3E2X8R1H152M080AD
TDK Corporation
CGA3E2X8R1H153K080AD
TDK Corporation
CGA3E2X8R1H153M080AD
TDK Corporation
CGA3E2X8R1H223K080AD
TDK Corporation
CGA3E2X8R1H332K080AD
TDK Corporation
CGA3E2X8R1H332M080AD
TDK Corporation
CGA3E2X8R1H333K080AD
TDK Corporation
CGA3E2X8R1H333M080AD
TDK Corporation
CGA3E2X8R1H473K080AD
TDK Corporation
CGA3E2X8R1H682K080AD
TDK Corporation
XCV100E-8FG256C
Xilinx Inc.
M2GL050T-1FGG484
Microsemi Corporation
A3P250L-1VQ100
Microsemi Corporation
EP3C80F484C8
Intel
5CEBA4F17C6N
Intel
5SGXEA5N3F45C2N
Intel
XC2V1500-5FFG896I
Xilinx Inc.
A54SX32A-2BG329I
Microsemi Corporation
A3PE1500-1FGG676I
Microsemi Corporation
EPF10K100EQC240-1
Intel