Home / Products / Integrated Circuits (ICs) / Embedded - Microcontrollers / EFM32G890F64-BGA112
Manufacturer Part Number | EFM32G890F64-BGA112 |
---|---|
Future Part Number | FT-EFM32G890F64-BGA112 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | Gecko |
EFM32G890F64-BGA112 Status (Lifecycle) | In Stock |
Part Status | Discontinued at Future Semiconductor |
Core Processor | ARM® Cortex®-M3 |
Core Size | 32-Bit |
Speed | 32MHz |
Connectivity | EBI/EMI, I²C, IrDA, SmartCard, SPI, UART/USART |
Peripherals | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT |
Number of I/O | 90 |
Program Memory Size | 64KB (64K x 8) |
Program Memory Type | FLASH |
EEPROM Size | - |
RAM Size | 16K x 8 |
Voltage - Supply (Vcc/Vdd) | 1.98V ~ 3.8V |
Data Converters | A/D 8x12b; D/A 2x12b |
Oscillator Type | Internal |
Operating Temperature | -40°C ~ 85°C (TA) |
Package / Case | Surface Mount |
Supplier Device Package | 112-LFBGA |
Base Part Number | 112-BGA (10x10) |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
EFM32G890F64-BGA112 Weight | Contact Us |
Replacement Part Number | EFM32G890F64-BGA112-FT |
MK22FN1M0AVMD12
NXP USA Inc.
MK26FN2M0VMD18
NXP USA Inc.
MK40DX256VMD10
NXP USA Inc.
MK61FX512VMD12
NXP USA Inc.
MK60DX256VMD10
NXP USA Inc.
MK21FN1M0AVMD12
NXP USA Inc.
MK64FX512VMD12
NXP USA Inc.
MK60FX512VMD12
NXP USA Inc.
MK50DN512CMD10
NXP USA Inc.
MK22FX512AVMD12
NXP USA Inc.
EP1C6T144C6N
Intel
XC2V500-6FGG256C
Xilinx Inc.
P1AFS600-2FG484I
Microsemi Corporation
LCMXO2280E-4FTN256I
Lattice Semiconductor Corporation
5SGXMA7N2F40C3N
Intel
EP4S100G5H40I1N
Intel
XC7K355T-2FF901I
Xilinx Inc.
XC7K480T-1FFG1156C
Xilinx Inc.
A54SX32A-BGG329I
Microsemi Corporation
M1A3P250-2FGG144I
Microsemi Corporation