Home / Products / Integrated Circuits (ICs) / Embedded - Microcontrollers / TC212S8F133SCACKXUMA1
Manufacturer Part Number | TC212S8F133SCACKXUMA1 |
---|---|
Future Part Number | FT-TC212S8F133SCACKXUMA1 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | AURIX™ |
TC212S8F133SCACKXUMA1 Status (Lifecycle) | In Stock |
Part Status | Active |
Core Processor | TriCore™ |
Core Size | 32-Bit |
Speed | 133MHz |
Connectivity | CANbus, LINbus, QSPI |
Peripherals | DMA, WDT |
Number of I/O | - |
Program Memory Size | 512KB (512K x 8) |
Program Memory Type | FLASH |
EEPROM Size | 64K x 8 |
RAM Size | 56K x 8 |
Voltage - Supply (Vcc/Vdd) | 3.3V |
Data Converters | A/D 24x12b |
Oscillator Type | External |
Operating Temperature | -40°C ~ 125°C (TA) |
Package / Case | Surface Mount |
Supplier Device Package | 80-TQFP Exposed Pad |
Base Part Number | PG-TQFP-80-7 |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
TC212S8F133SCACKXUMA1 Weight | Contact Us |
Replacement Part Number | TC212S8F133SCACKXUMA1-FT |
S1C17704F101100
Epson Electronics America Inc-Semiconductor Div
S1C17704F401100
Epson Electronics America Inc-Semiconductor Div
S1C17705F101100
Epson Electronics America Inc-Semiconductor Div
S1C17M01F00C100
Epson Electronics America Inc-Semiconductor Div
S1C17M01F201100
Epson Electronics America Inc-Semiconductor Div
S1C17M10F101100
Epson Electronics America Inc-Semiconductor Div
S1C17W22D00B000
Epson Electronics America Inc-Semiconductor Div
S1C17W22F00B100
Epson Electronics America Inc-Semiconductor Div
S6J3001LSESE1000B
Cypress Semiconductor Corp
S6J3001LSJSC1000A
Cypress Semiconductor Corp
EP1C6T144C6N
Intel
XC2V500-6FGG256C
Xilinx Inc.
P1AFS600-2FG484I
Microsemi Corporation
LCMXO2280E-4FTN256I
Lattice Semiconductor Corporation
5SGXMA7N2F40C3N
Intel
EP4S100G5H40I1N
Intel
XC7K355T-2FF901I
Xilinx Inc.
XC7K480T-1FFG1156C
Xilinx Inc.
A54SX32A-BGG329I
Microsemi Corporation
M1A3P250-2FGG144I
Microsemi Corporation